By combining substrate-free structures with anodic bonding technology, we present a simple and efficient micro-electro-mechanical system (MEMS) thermal shear stress sensor. Significantly, the resulting depth of the vacuum cavity of the sensor is determined by the thickness of silicon substrate at which Si is removed by anisotropic wet etching process. Compared with the sensor based on a sacrifi...

Concept and design of a low cost two-axes MEMS scanning mirror with an aperture size of 7 millimetres for a compact automotive LIDAR sensor is presented. Hermetic vacuum encapsulation and stacked vertical comb drives are the key features to enable a large tilt angle of 15 degrees. A tripod MEMS mirror design provides an advantageous ratio of mirror aperture and chip size and allows circular las...

We present the design and fabrication of a single axis low noise accelerometer in an unmodified commercial MicroElectroMechanical Systems (MEMS) process. The new microfabrication process, MEMS Integrated Design for Inertial Sensors (MIDIS), introduced by Teledyne DALSA Inc. allows wafer level vacuum encapsulation at 10 milliTorr which provides a high Quality factor and reduces noise interferenc...

The fabrication of SiC MEMS pressure sensor based on novel vacuum-sealed method is presented in this paper. The sensor was fabricated using surface micromachining. Due to its excellent mechanical properties and high chemical resistance, PECVD (Plasma Enhanced Chemical Vapor Deposition) SiC was chosen as structural material. Polyimide is the sacrificial layer which solve stiction problem in proc...

By applying the micro-electro-mechanical-system (MEMS) fabrication technology, we developed a micro-thermal sensor to measure surface shear stress. The heat transfer from a polysilicon heater depends on the normal velocity gradient and thus provides the surface shear stress. However, the sensitivity of the shear-stress measurements in air is less than desirable due to the low heat capacity of a...

This paper reports on numerical modeling and simulation of a generalized contact-type MEMS device having large potential in various micro-sensor/actuator applications, which are currently limited because of detrimental effects of the contact bounce phenomenon that is still not fully explained and requires comprehensive treatment. The proposed 2-D finite element model encompasses cantilever micr...

Abstract This paper describes a highly sensitive microelectromechanical systems (MEMS) accelerometer sensor module to measure micro muscle sounds. Regarding the drift mechanism, we focus on charged particles based residual water related MEMS fabrication. Based temperature programmed desorption analysis and electrical experiments, it is clarified that caused by negatively OH − suppressed vacuum ...

In this paper a new design of MEMS capacitive fingerprint sensors is presented. The capacitive sensor is made of two parallel plates with air gap. In these sensors, the capacitance changes is very important factor. It is caused by deformation of the upper electrode of sensor. In this study with making slots in upper electrode, using T-shaped protrusion on diaphragm in order to concentrate the f...